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27.08.2025
PREPARATION SYSTEM AND METHOD FOR ROLLED AEROGEL MATERIAL
EP 4606470A1 · YI JIANG FUTURE MAT CO LTD [CN] · IPC B01J, B01J
EP
27.08.2025
GLASS PLATE WITH ANTENNA
EP 4606568A2 · AGC INC [JP] · IPC B32B, C03C
EP
21.08.2025
Verfahren zur Herstellung einer keramischen Bremskomponente
DE 102024201531A1 · SKF AB [SE] · IPC B60T, C04B
DE
21.08.2025
Substrat mit hervorragender Ölbenetzung
DE 102024104735A1 · FRAUNHOFER GES FORSCHUNG [DE] · IPC A47J, A47J
DE
21.08.2025
Elektronikeinheit für einen Netzfilter
DE 102024201470A1 · BOSCH GMBH ROBERT [DE] · IPC H01G, H01G
DE
21.08.2025
Verfahren zur Herstellung eines brechungsindexangepassten photovernetzbaren keramischen Schlickers und Verfahren zur Herstellung einer brechungsindexgradierten Struktur
DE 102024104301A1 · BUNDESREPUBLIK DEUTSCHLAND BUNDESANSTALT · IPC B33Y, B33Y
DE
21.08.2025
FAHRZEUGFENSTERGLAS
DE 112023004590T5 · AGC INC [JP] · IPC B32B, B60J
DE
21.08.2025
CHIP-ON-WAFER-BAUGRUPPE, DIE EINEN ENTKOPPLUNGSKONDENSATOR ENTHÄLT
DE 112023004603T5 · KYOCERA AVX COMPONENTS CORP [US] · IPC H01G, H01G
DE
21.08.2025
Mehrschichtiger Kondensator
DE 112023004552T5 · KYOCERA AVX COMPONENTS CORP [US] · IPC H01G, H01G
DE
21.08.2025
AKTIVE MIKROELEKTRONISCHE BAUGRUPPE, DIE EINEN ENTKOPPLUNGSKONDENSATOR ENTHÄLT
DE 112023004599T5 · KYOCERA AVX COMPONENTS CORP [US] · IPC H01G, H01G
DE
21.08.2025
Chip-on-Interposer-Baugruppe, die einen Entkopplungskondensator enthält
DE 112023004606T5 · KYOCERA AVX COMPONENTS CORP [US] · IPC H01G, H01G
DE
21.08.2025
LITHIUM-FREE HIGH MODULUS FIBERGLASS COMPOSITION
US 2025263328A1 · OWENS CORNING INTELLECTUAL CAPITAL LLC [ · IPC C03B, C03C
US
21.08.2025
FLASH LAMP TREATMENT OF CHEMICALLY-BONDED PHOSPHATE CERAMIC PRECURSORS FOR DIRECT ADDITIVE MANUFACTURE OF CERAMIC COMPOSITES
US 2025262795A1 · GEORGIA TECH RES INST [US] · IPC B28B, B33Y
US
21.08.2025
CERAMIC COMPONENT, CERAMIC/METAL COMPONENT, MANUFACTURING METHOD THEREFOR AND APPLICATIONS THEREOF
US 2025262796A1 · CITY UNIV OF HONG KONG SHENZHEN FUTIAN R · IPC B28B, B28B
US
21.08.2025
SUBSTRATE, NATIVELY COLORED GLASS HOUSING, AND METHODS OF CHEMICALLY STRENGTHENING THE SAME
US 2025263333A1 · CORNING INC [US] · IPC C03C
US
21.08.2025
WAVEGUIDE COATING OPTIMISATION
US 2025263330A1 · ENVISICS LTD [GB] · IPC C03C, G02B
US
21.08.2025
TRANSPARENT ARTICLES AND DISPLAY ARTICLES WITH MEDIUM INDEX LAYERS AND HIGH SHALLOW HARDNESS
US 2025263332A1 · CORNING INC [US] · IPC C03C, C03C
US
21.08.2025
INSERTION OF CERAMIC MEMBERS FOR GAS PATH ENDWALL CONTOURING
US 2025263345A1 · RTX CORP [US] · IPC C04B, C04B
US
21.08.2025
MULTI-LAYER CERAMIC CAPACITOR
US 2025266211A1 · YAGEO CORP [TW] · IPC H01G, H01G
US
21.08.2025
EXTENDED INNER PROFILE FOR MANDREL FOR USE IN FORMING BRAIDED CMC STRUCTURES
US 2025263872A1 · RTX CORP [US] · IPC C04B, D04C
US
21.08.2025
MULTI-PIECE MANDREL FOR BUILDING UP AIRFOIL STRUCTURE
US 2025264027A1 · RTX CORP [US] · IPC C04B, C04B
US
21.08.2025
CERAMIC COMPONENT
US 2025263343A1 · RTX CORP [US] · IPC C04B, C04B
US
21.08.2025
MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD
US 2025266210A1 · TAIYO YUDEN KK [JP] · IPC H01G, H01G
US
21.08.2025
GLASS COMPOSITION FOR GLASS FIBER, GLASS FIBER, GLASS FIBER WOVEN FABRIC, AND GLASS FIBER REINFORCED RESIN COMPOSITION
US 2025263329A1 · NITTO BOSEKI CO LTD [JP] · IPC C03C, C03C
US
21.08.2025
CONFORMABLE TOOLING SYSTEMS AND METHODS FOR COMPLEX CONTOUR COMPOSITE PREFORMS
US 2025262801A1 · GOODRICH CORP [US] · IPC B28B, B28B
US
21.08.2025
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
US 2025266206A1 · MURATA MANUFACTURING CO [JP] · IPC H01F, H01G
US
21.08.2025
GLASS PLATE AND METHOD FOR PRODUCING GLASS PLATE
US 2025263327A1 · AGC INC [JP] · IPC C03B, C03C
US
21.08.2025
EXPANDABLE MALE DIE BLADDER FOR MATCH DIE SHAPE-FORMING SYSTEMS AND METHODS
US 2025263344A1 · GOODRICH CORP [US] · IPC C04B
US
21.08.2025
LAMINATE
US 2025263331A1 · DAIKIN IND LTD [JP] · IPC C03C, C03C
US
21.08.2025
COVER PLATE, DISPLAY MODULE, AND DISPLAY DEVICE
US 2025267812A1 · CHENGDU BOE OPTOELECT TECH CO [CN] · IPC B32B, B32B
US
21.08.2025
REINFORCED GLASS PLATE, METHOD FOR MANUFACTURING REINFORCED GLASS PLATE, AND GLASS PLATE TO BE REINFORCED
US 2025263324A1 · NIPPON ELECTRIC GLASS CO [JP] · IPC C03C, C03C
US
21.08.2025
GLASS SUBSTRATE FOR MAGNETIC RECORDING MEDIUM, GLASS DISK FOR MAGNETIC RECORDING MEDIUM, METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM, AND METHOD FOR MANUFACTURING GLASS DISK
US 2025263325A1 · NIPPON ELECTRIC GLASS CO [JP] · IPC C03C, G11B
US
21.08.2025
MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME
US 2025266209A1 · SAMSUNG ELECTRO MECH [KR] · IPC H01G, H01G
US
21.08.2025
SEMICONDUCTOR DEVICE HAVING A HIGH BREAKDOWN VOLTAGE CAPACITOR AND METHOD FOR FORMING THE SAME
US 2025266212A1 · SK KEYFOUNDRY INC [KR] · IPC H01G, H01G
US
21.08.2025
METHOD AND SYSTEM FOR MOLDED COATING ON CMC
US 2025262800A1 · RTX CORP [US] · IPC B28B, B28B
US
21.08.2025
VIBRATOR AND VIBRATION WAVE MOTOR
US 2025264687A1 · NIKON CORP [JP] · IPC C04B, G02B
US
21.08.2025
FUSION-FORMABLE GLASS-BASED ARTICLES INCLUDING A METAL OXIDE CONCENTRATION GRADIENT
US 2025263334A1 · CORNING INC [US] · IPC C03C, C03C
US
21.08.2025
GLASSES HAVING NON-FRANGIBLE STRESS PROFILES
US 2025263326A1 · CORNING INC [US] · IPC C03C, C03C
US
21.08.2025
LITHIUM-FREE HIGH MODULUS FIBERGLASS COMPOSITION
WO 2025174682A1 · OWENS CORNING INTELLECTUAL CAPITAL LLC [ · IPC C03C, C03C
WO
21.08.2025
INSULATING PRODUCT FOR A CONSTRUCTION ELEMENT COMPRISING A CAVITY
WO 2025172059A1 · SAINT GOBAIN ISOVER [FR] · IPC C03C, C03C
WO
21.08.2025
CERAMIC GRANULE, METHOD FOR PRODUCING CERAMIC GRANULE, METHOD FOR PRODUCING CERAMIC MOLDED BODY, AND METHOD FOR PRODUCING CERAMIC SINTERED BODY
WO 2025173598A1 · AGC INC [JP] · IPC B01J, C04B
WO
21.08.2025
ELECTRONIC COMPONENT
WO 2025173331A1 · TDK CORP [JP] · IPC H01G, H03H
WO
21.08.2025
SILICON NITRIDE SINTERED BODY AND METHOD FOR PRODUCING SAME, AND CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
WO 2025173742A1 · DENKA COMPANY LTD [JP] · IPC C04B, H01L
WO
21.08.2025
THIN-FILM CAPACITOR
WO 2025173472A1 · TDK CORP [JP] · IPC H01G, H01G
WO
21.08.2025
MULTILAYER CERAMIC CAPACITOR
WO 2025173381A1 · MURATA MANUFACTURING CO [JP] · IPC H01G
WO
21.08.2025
FURNACE-BASED THERMAL-SHOCK SYSTEMS AND METHODS
WO 2025175186A1 · UNIV MARYLAND [US] · IPC B28B, B33Y
WO
21.08.2025
MULTILAYER CERAMIC ELECTRONIC COMPONENT
WO 2025173382A1 · MURATA MANUFACTURING CO [JP] · IPC H01G
WO
21.08.2025
SILICON NITRIDE SINTERED COMPACT AND CIRCUIT BOARD
WO 2025173745A1 · DENKA COMPANY LTD [JP] · IPC C04B, H01L
WO
21.08.2025
METHOD FOR PRODUCING GRANULES, METHOD FOR PRODUCING NITRIDE CERAMIC SINTERED COMPACT, AND GRANULES
WO 2025173597A1 · AGC INC [JP] · IPC C04B, C04B
WO
21.08.2025
ADHESIVE SHEET AND LAMINATE USING SAME
WO 2025173519A1 · TOMOEGAWA CORP [JP] · IPC B32B, B32B
WO
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